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Verdin AM62

AM62 Computer on Module - Verdin AM62

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The Verdin AM62 is a Toradex System on Module based on the TI AM62x SoC, and a member of the Verdin Family.

This page provides hardware design resources, documentation, revision history, erratas, compatibility details, and getting started guides for developers working with the Verdin AM62 module.

Getting Started

Recommendation for the first-time order

Toradex recommends ordering the following additional products for your first-time order:

All products are available for online purchase through the Toradex Webshop.

Quickstart Guide

Check out our guide for detailed instructions on how to get your board up and running with Torizon:

Having trouble?

Please contact our technical support. Various options of technical support are mentioned below:

Product Features

Hardware Features

Compatible Products

Block Diagram

Verdin AM62 V1.2

Pinout Evaluation & Planning

Power Consumption

Product Documents

Datasheets

Verdin AM62 V1.2

Verdin AM62 V1.1

Design Resources

Toradex provides two different 3D models for Verdin Systems on Module:

  • Generic 3D Mechanical Models: This model has the maximum component height for testing the mechanical fit. This ensures the mechanical design fits all current Verdin modules as well as future releases.

  • Specific 3D Mechanical Models: These models are simplified models of the respective Verdin module. They contain only the PCB and the CPU and are intended to be used for heat spreader or heat sink designs. The CPU height is a typical value. Due to production tolerances, the actual height of the assembled component can be different.

Generic 3D Mechanical Models

The generic Verdin 3D model contains the PCB and the maximum component height on top and bottom of modules from the Verdin Module Family. This model should be used to test the mechanical fit, ensuring that the mechanical design fits all current Verdin modules as well as future releases.

Specific 3D Mechanical Models

The Verdin AM62 3D model is simplified and contains only the PCB and the CPU. It is intended to be used for heat spreader or heat sink designs. The CPU height is a typical value. Due to production tolerances, the actual height of the assembled component can be different. Please use the Generic Verdin 3D Mechanical Models with the maximum component height for testing the mechanical fit. This ensures the mechanical design fits all current Verdin modules as well as future releases.

Hardware Ecosystem

Carrier Boards

Off-the-shelf Carrier Boards

Learn more on the Verdin Product Family Specification.

Custom Carrier Board Design

Find free reference designs, schematics, 3D designs, and tools to build your carrier board easily in the link below:

Accessories & Add-ons

Check other options and compatibility information on the add-ons product pages.

Software Ecosystem

Toradex-Supported Linux Platforms

The following Linux-based offerings are in-house supported - pre-built images available for quick evaluation:

Industry and Partner Software Ecosystem

For detailed instructions about software development, including other operating systems for Toradex Computer on Modules - QNX, Android and more - check out our software ecosystem page:

Development Resources

Installing the Operating System

Toradex SoMs come with Toradex Easy Installer pre-installed. Once you power-on the board, it will display a list of available images to be installed. Check out how to get started with the Toradex Easy Installer:

You might need to enter recovery mode:

You can also install the compatible pre-built images available for download:

Connecting to the Board

During development, you will need to communicate the board with your host machine:

Revision History

Click to See the Product Numbering Scheme

Product Number (PID8) Format

The format of the 8-digits Product Number (PID8) is the following:

Product Numbering Scheme

The below table describes the structure of the Product Number (PID8):

FieldDescription
PPPP4-digits number, indicating the Product Configuration (PID4) that describes the key properties of the product (e.g. Product Group, RAM capacity, etc.)
VV2-digits number, indicating the Major and Minor Version (in that order)
AA2-digits number, indicating the Assembly Variant

See the complete list of available combinations on the Revision History table of the corresponding product page.

Example

Product number (PID8): 00291100:

0029: Apalis iMX6D 512MB

11: Major Version 1, Minor Version 1, Version V1.1 in short

00: Assembly Variant A

A specific product revision has a lifecycle defined by the product state. Learn more about it on the Product Change Notifications.

0076 Verdin AM62 Quad 2GB WB IT

Product #Product DescriptionChanges from Previous VersionRelease DateRelated Documents

00761100

Verdin AM62 Quad 2GB WB IT V1.1A

Initial Release

Q3 2023

None

00761101

Verdin AM62 Quad 2GB WB IT V1.1B

  • PCB manufacturer change to the volume PCB manufacturer
  • Change RAM from Micron MT53E1G16D1FW-046 AIT:A to MT53E1G16D1ZW-046 AIT:C

Q2 2024

None

00761102

Verdin AM62 Quad 2GB WB IT V1.1C

PCB manufacturing update to solve and mitigate Errata #4: HAR-10889 – A manufacturing issue might affect the V1.1B functionality

Q2 2024

Verdin AM62 Errata

00761200

Verdin AM62 Quad 2GB WB IT V1.2A

  • Change eMMC from Kingston EMMC16G-IB29-90F01 to SkyHigh S40FC016C3B1I00300
  • Changed RBIAS resistor on Ethernet PHY from 10k to 11k per TI recommendation
  • Design improvements related to supporting Suspend-to-RAM functionality
  • Added a dedicated LDO with enable pin for supplying VPP voltage which is used for fusing the OTP memory of AM62 SoC
  • Improvements to the JTAG circuitry
  • Added compatibility for TPM 2.0 with possibility to use SPI via carrier board loopback or I2C on SoM
  • Maya-W1 input voltage change to 3V3 solving Errata #5: HAR-110989 – The Verdin AM62 MAYA-W1 input voltage is higher than the reccomended absolute maximum rating

Q3 2024

Verdin AM62 Errata

0075 Verdin AM62 Dual 1GB WB IT

Product #Product DescriptionChanges from Previous VersionRelease DateRelated Documents

00751100

Verdin AM62 Dual 1GB WB IT V1.1A

Initial Release

Q3 2023

None

00751101

Verdin AM62 Dual 1GB WB IT V1.1B

PCB manufacturer change to the volume PCB manufacturer

Q2 2024

None

00751102

Verdin AM62 Dual 1GB WB IT V1.1C

PCB manufacturing update to solve and mitigate Errata #4: HAR-10889 – A manufacturing issue might affect the V1.1B functionality

Q2 2024

Verdin AM62 Errata

00751200

Verdin AM62 Dual 1GB WB IT V1.2A

  • Change RAM from Micron MT53D512M16D1DS-046 IT:D to Nanya NT6AN512M16AV-J1I
  • Change eMMC from Micron MTFC8GAKAJCN-4M IT to SkyHigh S40FC008C3B1I00000
  • Changed RBIAS resistor on Ethernet PHY from 10k to 11k per TI recommendation
  • Design improvements related to supporting Suspend-to-RAM functionality
  • Added a dedicated LDO with enable pin for supplying VPP voltage which is used for fusing the OTP memory of AM62 SoC
  • Improvements to the JTAG circuitry
  • Added compatibility for TPM 2.0 with possibility to use SPI via carrier board loopback or I2C on SoM
  • Maya-W1 input voltage change to 3V3 solving Errata #5: HAR-110989 – The Verdin AM62 MAYA-W1 input voltage is higher than the reccomended absolute maximum rating

Q3 2024

Verdin AM62 Errata

0074 Verdin AM62 Dual 1GB IT

Product #Product DescriptionChanges from Previous VersionRelease DateRelated Documents

00741100

Verdin AM62 Dual 1GB IT V1.1A

Initial Release

Q3 2023

None

00741101

Verdin AM62 Dual 1GB IT V1.1B

PCB manufacturer change to the volume PCB manufacturer

Q2 2024

None

00741102

Verdin AM62 Dual 1GB IT V1.1C

PCB manufacturing update to solve and mitigate Errata #4: HAR-10889 – A manufacturing issue might affect the V1.1B functionality

Q2 2024

Verdin AM62 Errata

00741200

Verdin AM62 Dual 1GB IT V1.2A

  • Change RAM from Micron MT53D512M16D1DS-046 IT:D to Nanya NT6AN512M16AV-J1I
  • Change eMMC from Micron MTFC8GAKAJCN-4M IT to SkyHigh S40FC008C3B1I00000
  • Changed RBIAS resistor on Ethernet PHY from 10k to 11k per TI recommendation
  • Design improvements related to supporting Suspend-to-RAM functionality
  • Added a dedicated LDO with enable pin for supplying VPP voltage which is used for fusing the OTP memory of AM62 SoC
  • Improvements to the JTAG circuitry
  • Added compatibility for TPM 2.0 with possibility to use SPI via carrier board loopback or I2C on SoM

Q3 2024

None

0073 Verdin AM62 Dual 1GB ET

Product #Product DescriptionChanges from Previous VersionRelease DateRelated Documents

00731100

Verdin AM62 Dual 1GB ET V1.1A

Initial Release

Q3 2023

None

00731101

Verdin AM62 Dual 1GB ET V1.1B

  • PCB manufacturer change to the volume PCB manufacturer
  • Remove Temperature Sensor

Q2 2024

None

00731102

Verdin AM62 Dual 1GB ET V1.1C

PCB manufacturing update to solve and mitigate Errata #4: HAR-10889 – A manufacturing issue might affect the V1.1B functionality

Q2 2024

Verdin AM62 Errata

00731200

Verdin AM62 Dual 1GB ET V1.2A

  • Change RAM from Micron MT53D512M16D1DS-046 WT:D to Nanya NT6AN512M16AV-J1
  • Changed RBIAS resistor on Ethernet PHY from 10k to 11k per TI recommendation
  • Design improvements related to supporting Suspend-to-RAM functionality
  • Added a dedicated LDO with enable pin for supplying VPP voltage which is used for fusing the OTP memory of AM62 SoC
  • Improvements to the JTAG circuitry
  • Added compatibility for TPM 2.0 with possibility to use SPI via carrier board loopback or I2C on SoM

Q3 2024

None

0072 Verdin AM62 Solo 512MB WB IT

Product #Product DescriptionChanges from Previous VersionRelease DateRelated Documents

00721100

Verdin AM62 Solo 512MB WB IT V1.1A

Initial Release

Q3 2023

None

00721101

Verdin AM62 Solo 512MB WB IT V1.1B

  • Change SoC from Texas Instruments AM6231ASGGGAALW to AM6231ASGGHAALW (SoC with HSFS - Secure SoC)
  • PCB manufacturer change to the volume PCB manufacturer

Q2 2024

None

00721103

Verdin AM62 Solo 512MB WB IT V1.1D

PCB manufacturing update to solve and mitigate Errata #4: HAR-10889 – A manufacturing issue might affect the V1.1B functionality

Q2 2024

Verdin AM62 Errata

00721200

Verdin AM62 Solo 512MB WB IT V1.2A

  • Change eMMC from Macronix MX52LM04A11XUI to SkyHigh S40FC004C1B1I00
  • Changed RBIAS resistor on Ethernet PHY from 10k to 11k per TI recommendation
  • Design improvements related to supporting Suspend-to-RAM functionality
  • Added a dedicated LDO with enable pin for supplying VPP voltage which is used for fusing the OTP memory of AM62 SoC
  • Improvements to the JTAG circuitry
  • Added compatibility for TPM 2.0 with possibility to use SPI via carrier board loopback or I2C on SoM
  • Maya-W1 input voltage change to 3V3 solving Errata #5: HAR-110989 – The Verdin AM62 MAYA-W1 input voltage is higher than the reccomended absolute maximum rating
  • PMIC fusing change to reduce VDD_CORE voltage to 0.75V for improved power consumption

Q3 2024

Verdin AM62 Errata

0071 Verdin AM62 Solo 512MB

Product #Product DescriptionChanges from Previous VersionRelease DateRelated Documents

00711100

Verdin AM62 Solo 512MB V1.1A

Initial Release

Q3 2023

None

00711101

Verdin AM62 Solo 512MB V1.1B

  • Change SoC from Texas Instruments AM6231ASGGGAALW to AM6231AKGGHHALW (SoC with HSFS - Secure SoC)
  • PCB manufacturer change to the volume PCB manufacturer
  • Remove Temperature Sensor

Q2 2024

None

00711102

Verdin AM62 Solo 512MB V1.1C

PCB manufacturing update to solve and mitigate Errata #4: HAR-10889 – A manufacturing issue might affect the V1.1B functionality

Q2 2024

Verdin AM62 Errata

00711200

Verdin AM62 Solo 512MB V1.2A

  • Changed RBIAS resistor on Ethernet PHY from 10k to 11k per TI recommendation
  • Design improvements related to supporting Suspend-to-RAM functionality
  • Added a dedicated LDO with enable pin for supplying VPP voltage which is used for fusing the OTP memory of AM62 SoC
  • Improvements to the JTAG circuitry
  • Added compatibility for TPM 2.0 with possibility to use SPI via carrier board loopback or I2C on SoM
  • PMIC fusing change to reduce VDD_CORE voltage to 0.75V for improved power consumption

Q3 2024

None

Errata/Known issues

SoC Errata Document

SoM Errata Document

Hardware Issue Tracker

Software Issue Tracker

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