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Verdin iMX8M Plus

NXP® i.MX 8M Plus Computer on Module Verdin iMX8M Plus

NXP® i.MX 8M Plus Computer on Module Verdin iMX8M Plus

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The Verdin iMX8M Plus is a Toradex System on Module based on the NXP iMX8M Plus SoC, and a member of the Verdin Family.

This page provides hardware design resources, documentation, revision history, erratas, compatibility details, and getting started guides for developers working with the Verdin iMX8M Plus module.

Getting Started​

Recommendation for the first-time order​

Toradex recommends ordering the following additional products for your first-time order:

All products are available for online purchase through the Toradex Webshop.

Quickstart Guide​

Check out our guide for detailed instructions on how to get your board up and running with Torizon:

Having trouble?​

Please contact our technical support. Various options of technical support are mentioned below:

Product Features​

Hardware Features​

Compatible Products​

Block Diagram​

Verdin iMX8M Plus V1.1

Pinout Evaluation & Planning​

Power Consumption​

Product Documents​

Datasheets​

Verdin iMX8M Plus V1.1

Verdin iMX8M Plus V1.0

Design Resources​

Toradex provides two different 3D models for Verdin Systems on Module:

  • Generic 3D Mechanical Models: This model has the maximum component height for testing the mechanical fit. This ensures the mechanical design fits all current Verdin modules as well as future releases.

  • Specific 3D Mechanical Models: These models are simplified models of the respective Verdin module. They contain only the PCB and the CPU and are intended to be used for heat spreader or heat sink designs. The CPU height is a typical value. Due to production tolerances, the actual height of the assembled component can be different.

Generic 3D Mechanical Models​

The generic Verdin 3D model contains the PCB and the maximum component height on top and bottom of modules from the Verdin Module Family. This model should be used to test the mechanical fit, ensuring that the mechanical design fits all current Verdin modules as well as future releases.

Specific 3D Mechanical Models​

The Verdin iMX8M Plus 3D model is simplified and contains only the PCB and the CPU. It is intended to be used for heat spreader or heat sink designs. The CPU height is a typical value. Due to production tolerances, the actual height of the assembled component can be different. Please use the Generic 3D Mechanical Models with the maximum component height for testing the mechanical fit. This ensures the mechanical design fits all current Verdin modules as well as future releases.

Hardware Ecosystem​

Carrier Boards​

Off-the-shelf Carrier Boards​

Learn more on the Verdin Product Family Specification.

Custom Carrier Board Design​

Find free reference designs, schematics, 3D designs, and tools to build your carrier board easily in the link below:

Accessories & Add-ons​

[1] This product reached End-of-Life (EOL) and is not available for purchase anymore.

Check other options and compatibility information on the add-ons product pages.

Software Ecosystem​

Toradex-Supported Linux Platforms​

The following Linux-based offerings are in-house supported - pre-built images available for quick evaluation:

Industry and Partner Software Ecosystem​

For detailed instructions about software development, including other operating systems for Toradex Computer on Modules - QNX, Android and more - check out our software ecosystem page:

Development Resources​

Installing the Operating System​

Toradex SoMs come with Toradex Easy Installer pre-installed. Once you power-on the board, it will display a list of available images to be installed. Check out how to get started with the Toradex Easy Installer:

You might need to enter recovery mode:

You can also install the compatible pre-built images available for download:

Connecting to the Board​

During development, you will need to communicate the board with your host machine:

Revision History​

Click to See the Product Numbering Scheme

Product Number (PID8) Format

The format of the 8-digits Product Number (PID8) is the following:

Product Numbering Scheme

The below table describes the structure of the Product Number (PID8):

FieldDescription
PPPP4-digits number, indicating the Product Configuration (PID4) that describes the key properties of the product (e.g. Product Group, RAM capacity, etc.)
VV2-digits number, indicating the Major and Minor Version (in that order)
AA2-digits number, indicating the Assembly Variant

See the complete list of available combinations on the Revision History table of the corresponding product page.

Example

Product number (PID8): 00291100:

0029: Apalis iMX6D 512MB

11: Major Version 1, Minor Version 1, Version V1.1 in short

00: Assembly Variant A

A specific product revision has a lifecycle defined by the product state. Learn more about it on the Product Change Notifications.

0070 Verdin iMX8M Plus Quad 8GB WB IT​

Product #Product DescriptionChanges from Previous VersionRelease DateRelated Documents

00701100

Verdin iMX8M Plus Quad 8GB WB IT V1.1A

  • Initial Release
  • Based on the 00581100 Verdin iMX8M Plus Quad 4GB WB IT V1.1A (see the related revision history entry below)
  • RAM capacity has been changed to 8GB (MT53E2G32D4DE-046 AIT:C)
  • Temperature Sensor TMP1075DSGR assembled on SoM

Q3, 2023

Verdin Product Family Specification


0058 Verdin iMX8M Plus Quad 4GB WB IT​

Product #Product DescriptionChanges from Previous VersionRelease DateRelated Documents

00581001

Verdin iMX8M Plus Quad 4GB WB IT V1.0B

Initial Release

Q2, 2020

Verdin Product Family Specification Update


00581002

Verdin iMX8M Plus Quad 4GB WB IT V1.0C

  • Special development version with limited temperature range support (0°C to 70°C)
  • Replace SoC: PIMX8ML8CVNKZAB with PIMX8ML8DVNLZAB
  • Resolve the Bluetooth host interface strapping issue HAR-8341 (see the "Errata/Known issues" section for more details)
  • Other minor improvements

Q3, 2021

PCN Verdin iMX8M Plus Quad 4GB WB IT V1.0C 2022-06-07

00581003

Verdin iMX8M Plus Quad 4GB WB IT V1.0D

  • Regular version with full temperature range support (-40°C to +85°C)
  • Replace SoC: PIMX8ML8DVNLZAB with MIMX8ML8CVNKZAB

Q3, 2021

PCN Verdin iMX8M Plus Quad 4GB WB IT V1.0D 2022-06-07

00581004

Verdin iMX8M Plus Quad 4GB WB IT V1.0E

  • Replaced the eMMC MTFC16GAPALBH-IT with MTFC16GAPALBH-AAT (using the latter as a temporary solution for increasing the availability of the product)

Q1, 2022

PCN Verdin iMX8M Plus Quad 4GB WB IT V1.0E 2022-06-07

00581100

Verdin iMX8M Plus Quad 4GB WB IT V1.1A

  • The PCB design has been updated
  • The eMMC capacity has been increased from 16GB to 32GB
  • The eMMC part Micron MTFC16GAPALBH-IT (2D MLC) has been replaced with the Kingston EMMC32G-IX29-8AC01 (3D TLC)
  • The host controller interface of the Bluetooth module has been changed from SDIO to a full-featured UART interface (including flow control signals, served by the UART4 SoC interface)
  • The functionality of the Verdin USB_1_ID pin (pin 161 of the edge connector) has been restored (resolves HAR-6503, see the "Errata/Known issues" section for more details)
  • The ECSPI2 SoC pins have been eliminated from the Module-specific pins MSP_13, MSP_18, MSP_28, and MSP_33
  • The SoC pins serving the Verdin USB_2_OC# (pin 187 of the edge connector) and CSI_1_MCLK (pin 91 of the edge connector) pins have been swapped (resolves HAR-6498, see the "Errata/Known issues" section for more details)
  • The RX and TX signals of the I2S interface connected to the Bluetooth solution have been swapped on the SoC side (resolves HAR-6336, see the "Errata/Known issues" section for more details)
  • An assembly option for a PCB temperature sensor has been added (not assembled)
  • An assembly option for the ST ST33GTPMII2C TPM has been added (not assembled)
  • The assembly option for the Microchip ATTPM20 TPM has been eliminated
  • Other minor fixes and improvements

Q2 2022

Flash Memory Overview on Toradex Products
PCN Verdin iMX8M Plus Quad 4GB WB IT V1.1A 2023-11-27

00581101

Verdin iMX8M Plus Quad 4GB WB IT V1.1B

  • The RAM part Micron MT53E1G32D2FW-046 IT:A has been replaced with the Micron MT53E1G32D2FW-046 IT:B.
  • The previously not populated PCB temperature sensor assembly option has been assembled with the Texas Instruments TMP1075DSGR part.

Q1 2024

0063 Verdin iMX8M Plus Quad 4GB IT​

Product #Product DescriptionChanges from Previous VersionRelease DateRelated Documents

00631100

Verdin iMX8M Plus Quad 4GB IT V1.1A

  • Initial Release
  • Based on the 00581100 Verdin iMX8M Plus Quad 4GB WB IT V1.1A (see the related revision history entry above)
  • The Wi-Fi/Bluetooth solution has been eliminated
  • The ECSPI2 SoC pins have been kept available on the Module-specific pins MSP_13, MSP_18, MSP_28, and MSP_33

Q2 2022

Flash Memory Overview on Toradex Products
PCN Verdin iMX8M Plus Quad 4GB IT V1.1A 2023-11-27

00631101

Verdin iMX8M Plus Quad 4GB IT V1.1B

  • The RAM part Micron MT53E1G32D2FW-046 IT:A has been replaced with the Micron MT53E1G32D2FW-046 IT:B.
  • The previously not populated PCB temperature sensor assembly option has been assembled with the Texas Instruments TMP1075DSGR part.

Q1 2024

0064 Verdin iMX8M Plus Quad 2GB WB IT​

Product #Product DescriptionChanges from Previous VersionRelease DateRelated Documents

00641100

Verdin iMX8M Plus Quad 2GB WB IT V1.1A

  • Initial Release
  • Based on the 00581100 Verdin iMX8M Plus Quad 4GB WB IT V1.1A (see the related revision history entry above)
  • Changed SoC part number to NXP MIMX8ML6CVNKZAB (quad core, ISP, VPU, CAN-FD, IT, no NPU, no audio DSP)
  • RAM capacity has been changed to 2GB (MT53E512M32D1ZW-046 IT:B)
  • eMMC capacity has been changed to 16GB (EMMC16G-IB29-90F01)
  • Temperature Sensor TMP1075DSGR assembled on SoM

Q4 2023

Verdin Product Family Specification


0065 Verdin iMX8M Plus QuadLite 1GB IT​

Product #Product DescriptionChanges from Previous VersionRelease DateRelated Documents

00651100

Verdin iMX8M Plus QuadLite 1GB IT V1.1A

  • Initial Release
  • Based on the 00631100 Verdin iMX8M Plus Quad 4GB WB IT V1.1A (see the related revision history entry above)
  • Changed SoC part number to NXP MIMX8ML4CVNKZAB (quad core, no ISP, no VPU,no NPU, no audio DSP, CAN-FD, IT)
  • RAM capacity has been changed to 1GB (MT53E256M32D2DS-046 IT:B)
  • eMMC capacity has been changed to 8GB (MTFC8GAKAJCN-4M IT)
  • Temperature Sensor TMP1075DSGR assembled on SoM

Q4 2023

PCN Verdin iMX8M Plus QuadLite 1GB IT V1.1A 2025-09-22

00651101

Verdin iMX8M Plus QuadLite 1GB IT V1.1B

  • Improvement on supply voltage decoupling of Temperature Sensor

Q4 2025

0061 Verdin iMX8M Plus Quad 2GB (Obsolete)​

Product #Product DescriptionChanges from Previous VersionRelease DateRelated Documents

00611001

Verdin iMX8M Plus Quad 2GB V1.0B

Initial Release, Obsolete

Q2, 2020

Verdin Product Family Specification Update

Errata/Known issues​

SoC Errata Document​

SoM Errata Document​

Hardware Issue Tracker​

Software Issue Tracker​

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