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Verdin Development Board

Verdin Development Board

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Getting Started​

This section contains initial information needed to set-up the Verdin Development Board for the first time.

Recommendation for the First-Time Order​

Toradex recommends ordering the following additional products for your first-time order:

All the products can be ordered online at Toradex Webshop.

Starting Resources​

Installing the Operating System​

The Verdin SoMs come with Toradex Easy Installer pre-installed. Once you power-on the board, it will display a list of available images to be installed. Check out how to get started with the Toradex Easy Installer:

Quickstart Guide​

Check out our Quickstart Guide for detailed instructions on how to get started with Torizon and how it enables a faster time-to-market.

Developing Software​

For detailed instructions about how to start developing your software for Verdin Computer on Modules, check out our software ecosystem page. The following Linux-based offerings are currently supported:

Having trouble?​

Please contact our support team if you need technical support. Our communication channels are listed below:

Hardware Features​

Check the hardware features on the product page:

Compatible Products​

Block Diagram​

Verdin Development Board​

Verdin Development Board Block Diagram

Datasheets​

Verdin Development Board V1.1​

Verdin Development Board V1.1 Datasheet

Verdin Development Board V1.0​

Verdin Development Board V1.0 Datasheet

Design Resources​

warning

V1.1 packages are compatible with the latest Verdin Family Specification. If you are planning to design a custom carrier board, please rely on them.

Verdin Development Board Design Data V1.1​

Verdin Development Board Design Data V1.0​

Verdin Specifications​

Verdin Development Board Mechanical Models​

A basic 3D model for the Verdin Development Board V1.1 can be downloaded here:

Older Verdin Development Board V1.0 Models

Design and Layout Guide​

Altium Designer​

Revision History​

Click to See the Product Numbering Scheme

Product Number (PID8) Format​

The format of the 8-digits Product Number (PID8) is the following:

Product Numbering Scheme

The below table describes the structure of the Product Number (PID8):

FieldDescription
PPPP4-digits number, indicating the Product Configuration (PID4) that describes the key properties of the product (e.g. Product Group, RAM capacity, etc.)
VV2-digits number, indicating the Major and Minor Version (in that order)
AA2-digits number, indicating the Assembly Variant

See the complete list of available combinations on the Revision History table of the corresponding product page.

Example​

Product number (PID8): 00291100:

0029: Apalis iMX6D 512MB

11: Major Version 1, Minor Version 1, Version V1.1 in short

00: Assembly Variant A

A specific product revision has a lifecycle defined by the product state. Learn more about it on the Product Change Notifications.

Verdin Development Board​

PN: 0156

Product #Product DescriptionChanges from Previous VersionRelease DateRelated Documents

01561001

Verdin Development Board V1.0B

Initial Release

Q1 2020

Initial release, no PCN document

01561100

Verdin Development Board V1.1A

  • Implemented the changes related to the latest revision of the Verdin Family Specification
  • Input voltage range changed to 7-24V ±10%
  • Replaced Micro-USB connectors with USB-C connectors
  • Replaced Ethernet transceiver from Micrel KSZ9031RNXCA-QFN48 to Microchip KSZ9131RNXI
  • Replaced HDMI protection from NXP Semiconductors IP4786CZ32 to STMicroelectronics HDMI2C1-14HD
  • Replaced audio codec from CIRRUS WM8904CGEFL/RV to Nuvoton NAU88C22YG
  • Replaced bi-directional autosensing level shifters with unidirectional level shifters
  • Replaced MIPI DSI interface mezzanine connector and Type Specific mezzanine connector with LSS-130-03-L-DV-A-K-TR
  • Replaced buck converters AOZ2261AQI-10 with AOZ2261AQI-15

Q2 2021

Verdin Product Family Specification Update

01561101

Verdin Development Board V1.1B

  • Resolve the Bluetooth host interface strapping issue HAR-8342 (see the "Errata/Known issues" section for more details)
  • Increase the power rating of the CAN bus termination resistors
  • Other minor improvements

Q3 2021

01561102

Verdin Development Board V1.1C

  • Don’t assemble IC25: LTC4368IDD-2#PBF power input protection IC (important note: the overvoltage, overcurrent, and undervoltage protection features are not present with this product version due to component availability constraints; extra care should be taken to ensure that the input voltage is within the range 7-24V DC ±10%)
  • Assemble D21 with VS-MBRB735-M3 (for providing reverse polarity protection)
  • Allow IC36 to be assembled with either the SN65HVD01DRCR or the STR485LVQT (due to component availability constraints)
  • Change the value of R165, R168, R172, and R175 from 100kOhm to 1MOhm (resolves HAR-8833, see the "Errata/Known issues" section for more details)
  • Change the value of R319 from 10kOhm to 1MOhm (resolves HAR-8833, see the "Errata/Known issues" section for more details)
  • Don't assemble C173 (resolves HAR-8934, see the "Errata/Known issues" section for more details)
  • Don't assemble D19 (resolves HAR-8934, see the "Errata/Known issues" section for more details)

Q2 2022

01561103

Verdin Development Board V1.1D

  • Don’t assemble IC25: LTC4368IDD-2#PBF power input protection IC (important note: the overvoltage, overcurrent, and undervoltage protection features are not present with this product version due to component availability constraints; extra care should be taken to ensure that the input voltage is within the range 7-24V DC ±10%)
  • Change the RS232 transceiver (IC38) part number from TRS3122ERGER to XR32220EBER-L/TR (due to component availability constraints; important note: the replacement part is capable of data rates of up to 250 Kbps)
  • Change the component with the designator D30 from a diode to a 4.4nF capacitor with a 0805 package (resolves HAR-9004, see the "Errata/Known issues" section for more details)

Q3 2022


01561104

Verdin Development Board V1.1E

  • Update the silkscreen of the PCB (resolves HAR-8976, see the "Errata/Known issues" section for more details)
  • Other minor changes and improvements

Q4 2022


01561105

Verdin Development Board V1.1F

-Change the assembly state, part number of IC25 from “not assembled”, NA to “assembled”, any of LTC4368IDD-2#PBF or LTC4368HDD-2#PBF with supporting components
-Change the assembly state of D21 from “assembled” to “not assembled”
-Change the assembly state, value of R3 from "not assembled", NA to "assembled", 100kOhm
-Change the assembly state, value of R5 from "not assembled", NA to "assembled", 806kOhm
-Change the assembly state, value of R33 from "not assembled", NA to "assembled", 82.5kOhm
-Change the assembly state, value of R34 from "not assembled", NA to "assembled", 17.8kOhm
-Change the value of R279, R280 from 10kOhm to 2.2kOhm
-Change the manufacturer, part number of D23 from Littlefuse SMAJ30CA to any of Pulse SMAJ30CA, Comchip SMAJ30CA-HF, Rectron SMAJ30CAV-T
-Change the assembly state of C98, C108 from “assembled” to “not assembled”

Q4 2023


Errata/Known Issues​

Errata Document​

Verdin Development Board Errata

Errata/Known issues​

Migration in Progress

Issue trackers are not yet available in the new developer website. See it on the archived developer website.

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